Invention Grant
- Patent Title: Porous alumina templates for electronic packages
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Application No.: US14887674Application Date: 2015-10-20
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Publication No.: US09615451B2Publication Date: 2017-04-04
- Inventor: Rajesh Katkar , Cyprian Emeka Uzoh , Belgacem Haba , Ilyas Mohammed
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/00 ; H05K1/16 ; H05K1/11 ; H05K7/10 ; H05K1/03 ; H01L23/498 ; H01L21/48 ; H01L23/13 ; H05K3/40 ; H05K3/42

Abstract:
Interposers and methods of making the same are disclosed herein. In one embodiment, an interposer includes a region having first and second oppositely facing surfaces and a plurality of pores, each pore extending in a first direction from the first surface towards the second surface, wherein alumina extends along a wall of each pore; a plurality of electrically conductive connection elements extending in the first direction, consisting essentially of aluminum and being electrically isolated from one another by at least the alumina; a first conductive path provided at the first surface for connection with a first component external to the interposer; and a second conductive path provided at the second surface for connection with a second component external to the interposer, wherein the first and second conductive paths are electrically connected through at least some of the connection elements.
Public/Granted literature
- US20160044781A1 POROUS ALUMINA TEMPLATES FOR ELECTRONIC PACKAGES Public/Granted day:2016-02-11
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