- 专利标题： Method for manufacturing a circuit board structure
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申请号： US14076292申请日： 2013-11-11
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公开(公告)号： US09622354B2公开(公告)日： 2017-04-11
- 发明人: Risto Tuominen , Antti Iihola , Petteri Palm
- 申请人： GE Embedded Electronics Oy
- 申请人地址： FI Helsinki
- 专利权人： GE Embedded Electronics Oy
- 当前专利权人： GE Embedded Electronics Oy
- 当前专利权人地址： FI Helsinki
- 代理机构： Seppo Laine Oy
- 优先权： FI20050646 20050616
- 主分类号： H05K3/30
- IPC分类号： H05K3/30 ; H05K3/06 ; H01L21/48 ; H01L23/13 ; H05K1/18 ; H01L23/538 ; H01L23/544 ; H01L23/00 ; H05K3/20 ; H05K3/28 ; H05K3/32 ; H05K3/40
摘要：
A method for manufacturing a circuit-board structure wherein a conductor foil is provided on an insulating material layer, a resist layer is spread on the conductor foil and a recess formed in the conductor foil and insulating material layer. The resist layer is patterned to form a conductor-pattern having openings wherein conductor patterns may be grown. A component is attached to the conductor foil and conductor pattern and conductor material is removed which does not form part of a conductor pattern.
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