公开(公告)号：US20180376597A1

公开(公告)日：2018-12-27

申请号：US16104979

申请日：2018-08-20

申请人： GE Embedded Electronics Oy

发明人： Risto Tuominen ,  Petteri Palm

IPC分类号： H05K1/18 ,  H01L23/538 ,  H01L25/00 ,  H01L23/552 ,  H01L25/10 ,  H01L23/00 ,  H05K3/28 ,  H05K1/02 ,  H01L23/544 ,  H05K3/46 ,  H01L23/29

摘要： The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

公开(公告)号：US10085345B2

公开(公告)日：2018-09-25

申请号：US14467079

申请日：2014-08-25

申请人： GE Embedded Electronics Oy

发明人： Risto Tuominen ,  Petteri Palm

IPC分类号： H01K1/18 ,  H01L23/538 ,  H05K1/18 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L25/00 ,  H01L23/544 ,  H05K1/02 ,  H05K3/46 ,  H01L23/29 ,  H05K3/28

CPC分类号： H05K1/189 ,  H01L23/295 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/544 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/82132 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/284 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/166 ,  H01L2924/00

摘要： The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

公开(公告)号：US20150043177A1

公开(公告)日：2015-02-12

申请号：US14467079

申请日：2014-08-25

申请人： GE Embedded Electronics Oy

发明人： Risto Tuominen ,  Petteri Palm

IPC分类号： H05K1/02 ,  H05K1/18

CPC分类号： H05K1/189 ,  H01L23/295 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/544 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/82132 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/284 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/166 ,  H01L2924/00

摘要： The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

摘要翻译： 电子模块技术领域本发明涉及电子模块。 具体地，涉及一种包括嵌入在安装基座中的一个或多个部件的电子模块。 电子模块可以是类似于电路板的模块，其包括通过在模块中制造的导电结构电连接的多个部件。 这些组件可以是无源组件，微电路，半导体组件或其他类似组件。 通常连接到电路板的组件形成一组组件。 另一个重要的组件组件是通常封装以连接到电路板的组件。 本发明涉及的电子模块当然也可以包括其它类型的组件。

公开(公告)号：US10231335B2

公开(公告)日：2019-03-12

申请号：US14285710

申请日：2014-05-23

申请人： GE Embedded Electronics Oy

发明人： Petteri Palm ,  Tuomas Waris ,  Antti Iihola

IPC分类号： H05K1/11 ,  H05K1/18 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H05K1/14 ,  H05K3/20

摘要： The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation.

公开(公告)号：US20170071061A1

公开(公告)日：2017-03-09

申请号：US15355096

申请日：2016-11-18

申请人： GE Embedded Electronics Oy

发明人： Risto Tuominen ,  Antti Iihola ,  Petteri Palm

IPC分类号： H05K1/18 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56 ,  H05K3/30 ,  H05K3/28 ,  H01L21/48 ,  H01L23/544 ,  H05K3/06 ,  H05K3/32

CPC分类号： H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L21/568 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/205 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.

摘要翻译： 本公开公开了一种制造电路板结构的方法。 在该方法中，制造导体层，其在导体箔的表面上包括导体箔和导体图案。 将一个部件连接到导体层，并且导体层被薄化，使得导体层的导体材料从导体图案的外面去除。

公开(公告)号：US10085347B2

公开(公告)日：2018-09-25

申请号：US14660991

申请日：2015-03-18

申请人： GE Embedded Electronics Oy

发明人： Risto Tuominen ,  Petteri Palm ,  Antti Iihola

IPC分类号： H05K3/02 ,  H05K3/10 ,  F02M53/02 ,  F02M53/06 ,  F02M55/02 ,  F02M69/46 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H05K1/18 ,  H05K1/02 ,  H01L25/065 ,  H05K3/18

CPC分类号： H05K3/10 ,  F02M53/02 ,  F02M53/06 ,  F02M55/02 ,  F02M55/025 ,  F02M69/465 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H05K1/02 ,  H05K1/185 ,  H05K3/108 ,  H05K3/181 ,  H05K2203/0156 ,  H05K2203/1469 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： Method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing (101-102 or 101-103) an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer, in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conducting-pattern layers and, if necessary, insulator layers are manufactured (104) on one or both sides of the intermediate product, in such a way that, when manufacturing the first conducting-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages (101-105) can also be performed on a single manufacturing line.

公开(公告)号：US09622354B2

公开(公告)日：2017-04-11

申请号：US14076292

申请日：2013-11-11

申请人： GE Embedded Electronics Oy

发明人： Risto Tuominen ,  Antti Iihola ,  Petteri Palm

IPC分类号： H05K3/30 ,  H05K3/06 ,  H01L21/48 ,  H01L23/13 ,  H05K1/18 ,  H01L23/538 ,  H01L23/544 ,  H01L23/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40

CPC分类号： H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L21/568 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/205 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method for manufacturing a circuit-board structure wherein a conductor foil is provided on an insulating material layer, a resist layer is spread on the conductor foil and a recess formed in the conductor foil and insulating material layer. The resist layer is patterned to form a conductor-pattern having openings wherein conductor patterns may be grown. A component is attached to the conductor foil and conductor pattern and conductor material is removed which does not form part of a conductor pattern.