公开(公告)号：US20170271288A1

公开(公告)日：2017-09-21

申请号：US15611812

申请日：2017-06-02

Applicant: GE Embedded Electronics Oy

Inventor： Antti Iihola ,  Risto Tuominen

IPC: H01L23/00 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065 ,  H05K1/18 ,  H05K3/30

CPC classification number: H01L24/09 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/73217 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/188 ,  H05K3/305 ,  H05K2201/0969 ,  H05K2201/10674 ,  H01L2924/00

Abstract: Manufacturing method and a multi-chip package, which comprises a conductor pattern and insulation, and, inside the insulation, a first component, the contact terminals of which face towards the conductor pattern and are conductively connected to the conductor pattern. The multi-chip package also comprises inside the insulation a second semiconductor chip, the contact terminals of which face towards the same conductor pattern and are conductively connected through contact elements to this conductor pattern. The semiconductor chips are located in such a way that the first semiconductor chip is located between the second semiconductor chip and the conductor pattern.

公开(公告)号：US09691724B2

公开(公告)日：2017-06-27

申请号：US14161735

申请日：2014-01-23

Applicant: GE Embedded Electronics Oy

Inventor： Antti Iihola ,  Risto Tuominen

IPC: H01L23/02 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00 ,  H05K1/18 ,  H01L25/065 ,  H05K3/30

CPC classification number: H01L24/09 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/73217 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/188 ,  H05K3/305 ,  H05K2201/0969 ,  H05K2201/10674 ,  H01L2924/00

Abstract: Manufacturing method and a multi-chip package, which comprises a conductor pattern and insulation, and, inside the insulation, a first component, the contact terminals of which face towards the conductor pattern and are conductively connected to the conductor pattern. The multi-chip package also comprises inside the insulation a second semiconductor chip, the contact terminals of which face towards the same conductor pattern and are conductively connected through contact elements to this conductor pattern. The semiconductor chips are located in such a way that the first semiconductor chip is located between the second semiconductor chip and the conductor pattern.

公开(公告)号：US10470346B2

公开(公告)日：2019-11-05

申请号：US15990712

申请日：2018-05-28

Applicant: GE Embedded Electronics Oy

Inventor： Risto Tuominen

IPC: H05K9/00 ,  H01L23/00 ,  H05K1/18 ,  H05K1/02

Abstract: An electronic module with EMI protection is disclosed. The electronic module comprises a component with contact terminals and conducting lines in a first wiring layer. There is also a dielectric between the component and the first wiring layer such that the component is embedded in the dielectric. Contact elements provide electrical connection between at least some of the contact terminals and at least some of the conducting lines. The electronic module also comprises a second wiring layer inside the dielectric. The second wiring layer comprises a conducting pattern that is at least partly located between the component and the first wiring layer and provides EMI protection between the component and the conducting lines.

公开(公告)号：US20180376597A1

公开(公告)日：2018-12-27

申请号：US16104979

申请日：2018-08-20

Applicant: GE Embedded Electronics Oy

Inventor： Risto Tuominen ,  Petteri Palm

IPC: H05K1/18 ,  H01L23/538 ,  H01L25/00 ,  H01L23/552 ,  H01L25/10 ,  H01L23/00 ,  H05K3/28 ,  H05K1/02 ,  H01L23/544 ,  H05K3/46 ,  H01L23/29

Abstract: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

公开(公告)号：US10085345B2

公开(公告)日：2018-09-25

申请号：US14467079

申请日：2014-08-25

Applicant: GE Embedded Electronics Oy

Inventor： Risto Tuominen ,  Petteri Palm

IPC: H01K1/18 ,  H01L23/538 ,  H05K1/18 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L25/00 ,  H01L23/544 ,  H05K1/02 ,  H05K3/46 ,  H01L23/29 ,  H05K3/28

CPC classification number: H05K1/189 ,  H01L23/295 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/544 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/82132 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/284 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/166 ,  H01L2924/00

Abstract: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

公开(公告)号：US09999136B2

公开(公告)日：2018-06-12

申请号：US14569900

申请日：2014-12-15

Applicant: GE Embedded Electronics Oy

Inventor： Risto Tuominen

IPC: H05K3/30 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/42 ,  H05K3/46 ,  H01L23/00 ,  H01L23/538 ,  H01L21/48 ,  H01L25/065

CPC classification number: H05K3/30 ,  H01L21/486 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/00 ,  H01L24/24 ,  H01L24/82 ,  H01L25/065 ,  H01L2224/32225 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/12041 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/185 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/10522 ,  H05K2201/10674 ,  H05K2203/0588 ,  H05K2203/1469

Abstract: The present invention concerns an electronic module with at least one component embedded in insulating material. The electronic module comprises a first insulating material having a first surface and a second surface and a thickness between the first surface and the second surface, at least one opening through the first insulating material, a second insulating material on the second surface of the first insulating material, at least one component embedded in the second insulating material, at least one conductive pattern in the at least one opening, the at least one conductive pattern having a first surface and a second surface, wherein the second surface faces the second insulating material and the first surface faces away from the second insulating material and a distance between the first surface of the first insulating material and the second surface of the at least one conductive pattern is less or greater than the thickness of the first insulating material, an adhesive between the first insulating material and the at least one component, and connection elements between the at least one conductive pattern and the at least one component. The present invention further concerns a method for fabrication of an electronic module with at least one component embedded in an insulating layer.

公开(公告)号：US20150043177A1

公开(公告)日：2015-02-12

申请号：US14467079

申请日：2014-08-25

Applicant: GE Embedded Electronics Oy

Inventor： Risto Tuominen ,  Petteri Palm

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/189 ,  H01L23/295 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/544 ,  H01L23/552 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/82132 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/284 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/166 ,  H01L2924/00

Abstract: The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

Abstract translation: 电子模块技术领域本发明涉及电子模块。 具体地，涉及一种包括嵌入在安装基座中的一个或多个部件的电子模块。 电子模块可以是类似于电路板的模块，其包括通过在模块中制造的导电结构电连接的多个部件。 这些组件可以是无源组件，微电路，半导体组件或其他类似组件。 通常连接到电路板的组件形成一组组件。 另一个重要的组件组件是通常封装以连接到电路板的组件。 本发明涉及的电子模块当然也可以包括其它类型的组件。

公开(公告)号：US20170071061A1

公开(公告)日：2017-03-09

申请号：US15355096

申请日：2016-11-18

Applicant: GE Embedded Electronics Oy

Inventor： Risto Tuominen ,  Antti Iihola ,  Petteri Palm

IPC: H05K1/18 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56 ,  H05K3/30 ,  H05K3/28 ,  H01L21/48 ,  H01L23/544 ,  H05K3/06 ,  H05K3/32

CPC classification number: H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L21/568 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/205 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.

Abstract translation: 本公开公开了一种制造电路板结构的方法。 在该方法中，制造导体层，其在导体箔的表面上包括导体箔和导体图案。 将一个部件连接到导体层，并且导体层被薄化，使得导体层的导体材料从导体图案的外面去除。

公开(公告)号：US10085347B2

公开(公告)日：2018-09-25

申请号：US14660991

申请日：2015-03-18

Applicant: GE Embedded Electronics Oy

Inventor： Risto Tuominen ,  Petteri Palm ,  Antti Iihola

IPC: H05K3/02 ,  H05K3/10 ,  F02M53/02 ,  F02M53/06 ,  F02M55/02 ,  F02M69/46 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H05K1/18 ,  H05K1/02 ,  H01L25/065 ,  H05K3/18

CPC classification number: H05K3/10 ,  F02M53/02 ,  F02M53/06 ,  F02M55/02 ,  F02M55/025 ,  F02M69/465 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H05K1/02 ,  H05K1/185 ,  H05K3/108 ,  H05K3/181 ,  H05K2203/0156 ,  H05K2203/1469 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing (101-102 or 101-103) an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer, in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conducting-pattern layers and, if necessary, insulator layers are manufactured (104) on one or both sides of the intermediate product, in such a way that, when manufacturing the first conducting-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages (101-105) can also be performed on a single manufacturing line.

公开(公告)号：US20140131870A1

公开(公告)日：2014-05-15

申请号：US14161735

申请日：2014-01-23

Applicant: GE Embedded Electronics Oy

Inventor： Antti Iihola ,  Risto Tuominen

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/09 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/73217 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/188 ,  H05K3/305 ,  H05K2201/0969 ,  H05K2201/10674 ,  H01L2924/00

Abstract: Manufacturing method and a multi-chip package, which comprises a conductor pattern and insulation, and, inside the insulation, a first component, the contact terminals of which face towards the conductor pattern and are conductively connected to the conductor pattern. The multi-chip package also comprises inside the insulation a second semiconductor chip, the contact terminals of which face towards the same conductor pattern and are conductively connected through contact elements to this conductor pattern. The semiconductor chips are located in such a way that the first semiconductor chip is located between the second semiconductor chip and the conductor pattern.

Abstract translation: 制造方法和多芯片封装，其包括导体图案和绝缘体，并且在绝缘体内部，第一部件的接触端子面向导体图案并且导电地连接到导体图案。 多芯片封装还包括在绝缘体内部的第二半导体芯片，其接触端子面向相同的导体图案并且通过接触元件导电连接到该导体图案。 半导体芯片的位置使得第一半导体芯片位于第二半导体芯片和导体图案之间。