- 专利标题： Method for manufacturing a chip package having a coating layer
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申请号： US15226930申请日： 2016-08-03
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公开(公告)号： US09627228B1公开(公告)日： 2017-04-18
- 发明人: Shih-Chun Chen , Sheng-I Huang , Ying-Lin Chen , Ta-Hao Chang , I-Fong Wu , Chi-Chung Yu
- 申请人： Powertech Technology Inc.
- 申请人地址： TW Hsinchu County
- 专利权人： Powertech Technology Inc.
- 当前专利权人： Powertech Technology Inc.
- 当前专利权人地址： TW Hsinchu County
- 代理机构： Jianq Chyun IP Office
- 优先权： TW105114027A 20160505
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/552 ; H01L23/00 ; H01L21/48 ; H01L21/78
摘要：
A method for manufacturing a chip package structure having a coating layer is provided. At least one chip package structure is mounted onto a terminal-protection film. The chip package structure has a top side, a back side opposite to the top side and a plurality of lateral sides. A plurality of terminals is disposed on the back side. The terminal-protection film at least partially seals the back side. A coating layer is formed over the top side, the lateral sides and a periphery region of the chip package structure, wherein the coating layer is not formed on the back side and the terminals. The terminal-protection film is debonded from the chip package structure.
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