公开(公告)号：US09627228B1

公开(公告)日：2017-04-18

申请号：US15226930

申请日：2016-08-03

申请人： Powertech Technology Inc.

发明人： Shih-Chun Chen ,  Sheng-I Huang ,  Ying-Lin Chen ,  Ta-Hao Chang ,  I-Fong Wu ,  Chi-Chung Yu

IPC分类号： H01L21/56 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L21/78

CPC分类号： H01L21/78 ,  H01L21/4871 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/20 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/014

摘要： A method for manufacturing a chip package structure having a coating layer is provided. At least one chip package structure is mounted onto a terminal-protection film. The chip package structure has a top side, a back side opposite to the top side and a plurality of lateral sides. A plurality of terminals is disposed on the back side. The terminal-protection film at least partially seals the back side. A coating layer is formed over the top side, the lateral sides and a periphery region of the chip package structure, wherein the coating layer is not formed on the back side and the terminals. The terminal-protection film is debonded from the chip package structure.