- 专利标题： Supporting member separation method
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申请号： US14698049申请日： 2015-04-28
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公开(公告)号： US09627235B2公开(公告)日： 2017-04-18
- 发明人: Yasumasa Iwata , Yoshihiro Inao , Akihiko Nakamura , Shinji Takase , Takahiro Yoshioka
- 申请人： Tokyo Ohka Kogyo Co., Ltd.
- 申请人地址： JP Kawasaki-Shi
- 专利权人： TOKYO OHKA KOGYO CO., LTD.
- 当前专利权人： TOKYO OHKA KOGYO CO., LTD.
- 当前专利权人地址： JP Kawasaki-Shi
- 代理机构： Knobbe Martens Olson & Bear LLP
- 优先权： JP2014-097142 20140508; JP2015-039478 20150227
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; B32B43/00 ; H01L21/67 ; B32B37/02 ; B32B38/10 ; B32B38/18 ; B32B37/26
摘要：
A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.
公开/授权文献
- US20150325465A1 SUPPORTING MEMBER SEPARATION METHOD 公开/授权日：2015-11-12
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