Invention Grant
- Patent Title: High-voltage FinFET device having LDMOS structure and method for manufacturing the same
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Application No.: US14583771Application Date: 2014-12-29
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Publication No.: US09640663B2Publication Date: 2017-05-02
- Inventor: Tai-Ju Chen , Yi-Han Ye , Te-Chih Chen
- Applicant: UNITED MICROELECTRONICS CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORPORATION
- Current Assignee: UNITED MICROELECTRONICS CORPORATION
- Current Assignee Address: TW Hsinchu
- Agent Ding Yu Tan
- Priority: TW103139824A 20141117
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L21/762 ; H01L29/40 ; H01L29/08 ; H01L29/06 ; H01L29/165

Abstract:
A high-voltage FinFET device having LDMOS structure and a method for manufacturing the same are provided. The high-voltage FinFET device includes: at least one fin structure, a working gate, a shallow trench isolation structure, and a first dummy gate. The fin structure includes a first-type well region and a second-type well region adjacent to the first-type well region, and further includes a first part and a second part. A trench is disposed between the first part and the second part and disposed in the first-type well region. A drain doped layer is disposed on the first part which is disposed in the first-type well region, and a source doped layer is disposed on the second part which is disposed in the second-type well region. The working gate is disposed on the fin structure which is disposed in the first-type well region and in the second-type well region.
Public/Granted literature
- US20160141420A1 HIGH-VOLTAGE FINFET DEVICE HAVING LDMOS STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-05-19
Information query
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