Invention Grant
- Patent Title: Semiconductor packages usable with semiconductor chips having different pad arrangements and electronic devices having the same
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Application No.: US15051896Application Date: 2016-02-24
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Publication No.: US09653132B2Publication Date: 2017-05-16
- Inventor: Dae-Hoon Na , Hyun-Jin Kim , Jeong-Don Ihm
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2015-0078472 20150603
- Main IPC: G11C8/12
- IPC: G11C8/12 ; G11C16/08 ; H01L23/00 ; H01L25/065 ; G11C16/10 ; H01L23/525 ; G11C5/06 ; G11C16/26 ; G11C5/04 ; G11C5/02

Abstract:
A semiconductor package includes an external electrode, an interface chip, and a semiconductor chip. The interface chip includes an external interface pad bonded to the external electrode, a plurality of internal interface pads, and an interface circuit coupled between the external interface pad and the plurality of internal interface pads. The semiconductor chip includes a signal pad that is selectively bonded to one of the plurality of internal interface pads. The interface circuit activates a connection between a selected pad, which corresponds to a pad that is bonded to the signal pad among the plurality of internal interface pads, and the external interface pad, and deactivates connections between unselected pads, which correspond to pads that are not bonded to the signal pad among the plurality of internal interface pads, and the external interface pad.
Public/Granted literature
- US20160358655A1 SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES HAVING THE SAME Public/Granted day:2016-12-08
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