- 专利标题: Heated wafer carrier profiling
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申请号: US13483354申请日: 2012-05-30
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公开(公告)号: US09653340B2公开(公告)日: 2017-05-16
- 发明人: Vadim Boguslavskiy , Joshua Mangum , Matthew King , Earl Marcelo , Eric A. Armour , Alexander I. Gurary , William E. Quinn , Guray Tas
- 申请人: Vadim Boguslavskiy , Joshua Mangum , Matthew King , Earl Marcelo , Eric A. Armour , Alexander I. Gurary , William E. Quinn , Guray Tas
- 申请人地址: US NY Plainview
- 专利权人: Veeco Instruments Inc.
- 当前专利权人: Veeco Instruments Inc.
- 当前专利权人地址: US NY Plainview
- 代理机构: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号: C23C16/52
- IPC分类号: C23C16/52 ; G01N21/71 ; H01L21/687 ; G01N21/75 ; G01N23/20 ; H01L21/67 ; C23C16/458 ; C23C16/46 ; G01N21/74 ; G01N21/17
摘要:
An apparatus includes a carrier rotatable about an axis of rotation where the carrier has a top surface adapted to hold at least one semiconductor wafer and a surface characterization tool which is operative to move over a plurality of positions relative to the top surface of the carrier and/or the wafer transverse to the axis of rotation. The surface characterization tool is operative to move over a plurality of positions relative to the top surface of the carrier and/or the wafer transverse to the axis of rotation and is further adapted to produce characterization signals over the plurality of positions on at least a portion of the carrier and/or on at least a portion of said major surface of the wafer as the carrier rotates.
公开/授权文献
- US20120304926A1 HEATED WAFER CARRIER PROFILING 公开/授权日:2012-12-06
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