Invention Grant
- Patent Title: Method for forming fine patterns of semiconductor device
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Application No.: US15064628Application Date: 2016-03-09
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Publication No.: US09666434B2Publication Date: 2017-05-30
- Inventor: Jaehee Kim , Dae-Yong Kang , SoonMok Ha , Joonsoo Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2015-0054295 20150417
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/033 ; H01L21/768

Abstract:
A method for forming fine patterns includes patterning a hard mask layer on an etch target layer to form sacrificial pillars and a first opening disposed between the sacrificial pillars and exposing the etch target layer, forming a block copolymer layer on the etch target layer exposed through the first opening, phase-separating the block copolymer layer to form first block patterns spaced apart from the sacrificial pillars and a second block pattern, forming first holes by etching the etch target layer exposed by removing the first block patterns, and forming second holes in the etch target layer exposed by removing the sacrificial pillars, the second holes being different from the first holes.
Public/Granted literature
- US20160307755A1 METHOD FOR FORMING FINE PATTERNS OF SEMICONDUCTOR DEVICE Public/Granted day:2016-10-20
Information query
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