Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US14580703Application Date: 2014-12-23
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Publication No.: US09666463B2Publication Date: 2017-05-30
- Inventor: Katsuhiro Morikawa , Issei Ueda , Akira Murata , Junya Minamida
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2013-273035 20131227
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67

Abstract:
A throughput can be improved. A substrate processing apparatus includes processing units arranged in a vertical direction and configured to process substrates; and a substrate transfer device configured to be moved in the vertical direction and perform loading/unloading of the substrates into/from the processing units. Further, the substrate transfer device comprises a first transfer arm and a second transfer arm which are arranged in the vertical direction and configured to be moved in the vertical direction independently, and movement ranges of the first transfer arm and the second transfer arm in the vertical direction are overlapped with each other.
Public/Granted literature
- US20150187621A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2015-07-02
Information query
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