Invention Grant
- Patent Title: Semiconductor structure having a source and a drain with reverse facets
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Application No.: US14937029Application Date: 2015-11-10
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Publication No.: US09673296B2Publication Date: 2017-06-06
- Inventor: Thomas N. Adam , Kangguo Cheng , Ali Khakifirooz , Jinghong Li , Alexander Reznicek
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L21/336 ; H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/08 ; H01L21/02 ; H01L21/84

Abstract:
A semiconductor structure including a semiconductor wafer. The semiconductor wafer includes a gate structure, a first trench in the semiconductor wafer adjacent to a first side of the gate structure and a second trench adjacent to a second side of the gate structure, the first and second trenches filled with a doped epitaxial silicon to form a source in the filled first trench and a drain in the filled second trench such that each of the source and drain are recessed and have an inverted facet. In a preferred exemplary embodiment, the epitaxial silicon is doped with boron.
Public/Granted literature
- US20160064523A1 SEMICONDUCTOR STRUCTURE HAVING A SOURCE AND A DRAIN WITH REVERSE FACETS Public/Granted day:2016-03-03
Information query
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