Invention Grant
- Patent Title: Signal interconnect with high pass filter
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Application No.: US14747985Application Date: 2015-06-23
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Publication No.: US09673773B2Publication Date: 2017-06-06
- Inventor: Chunchen Liu , Po-Hung Chen , Zhengyu Duan
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H03H7/07 ; H03H7/38 ; H03H7/00 ; H03H7/06 ; H01P1/24 ; H03K19/00 ; H04B3/14 ; H04L25/03

Abstract:
A signal interconnect includes a transmission line, a termination circuit coupled to the transmission line, and a high pass filter circuit coupled in series along the transmission line. The high pass filter circuit includes a first resistive circuit and a first capacitive circuit coupled in parallel. The first resistive circuit has a resistance based on a difference between a resistance of the transmission line at a high frequency and a resistance of the transmission line at a low frequency.
Public/Granted literature
- US20160380607A1 SIGNAL INTERCONNECT WITH HIGH PASS FILTER Public/Granted day:2016-12-29
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