Invention Grant
- Patent Title: Peeling apparatus
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Application No.: US14740957Application Date: 2015-06-16
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Publication No.: US09676175B2Publication Date: 2017-06-13
- Inventor: Hiroki Adachi , Saki Eguchi , Masakatsu Ohno , Junpei Yanaka , Yoshiharu Hirakata
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2014-127355 20140620
- Main IPC: B32B43/00
- IPC: B32B43/00 ; H01L21/67 ; B32B37/12 ; B32B37/22 ; B32B38/10 ; B32B38/18 ; B32B39/00 ; H01L21/683 ; B32B37/00

Abstract:
A peeling apparatus including a support body supply unit, a support body hold unit, a transfer mechanism, and a first structure body. The first structure body has a convex surface. The support body supply unit has a function of unwinding a first support body and includes one of a pair of tension applying mechanisms. The support body hold unit includes the other of the pair of tension applying mechanisms. The pair of tension applying mechanisms applies tension to the first support body. The transfer mechanism has a function of transferring a process member. The first structure body has a function of bending back the first support body along the convex surface. The first structure body has a function of dividing the process member into a first member and a second member. An angle at which the first structure body bends back the first support body is an obtuse angle.
Public/Granted literature
- US20150367622A1 PEELING APPARATUS Public/Granted day:2015-12-24
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