Invention Grant
- Patent Title: Method for manufacturing semiconductor device using gate portion as etch mask
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Application No.: US14670324Application Date: 2015-03-26
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Publication No.: US09679991B2Publication Date: 2017-06-13
- Inventor: Hwi-Chan Jun , Deok-Han Bae , Hyun-Seung Song , Seung-Seok Ha
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2014-0089747 20140716
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66 ; H01L21/768 ; H01L21/311

Abstract:
Embodiments of the disclosure relate to a method for manufacturing a semiconductor device including a field effect transistor with improved electrical characteristics. According to embodiments of the disclosure, self-aligned contact plugs may be effectively formed using a metal hard mask portion disposed on a gate portion. In addition, a process margin of a photoresist mask for the formation of the self-aligned contact plugs may be improved by using the metal hard mask portion.
Public/Granted literature
- US20160020303A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2016-01-21
Information query
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