Invention Grant
- Patent Title: Deposition of films comprising aluminum alloys with high aluminum content
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Application No.: US14058406Application Date: 2013-10-21
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Publication No.: US09683287B2Publication Date: 2017-06-20
- Inventor: David Thompson , Srinivas Gandikota , Xinliang Lu , Wei Tang , Jing Zhou , Seshadri Ganguli , Jeffrey W. Anthis , Atif Noori , Faruk Gungor , Dien-Yeh Wu , Mei Chang , Shih Chung Chen
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: C23C16/12
- IPC: C23C16/12 ; C23C16/30 ; C23C16/455

Abstract:
Films comprising Aluminum, carbon and a metal, wherein the aluminum is present in an amount greater than about 16% by elemental content and the film has less than about 50% carbon. Methods of forming the films comprise exposing a substrate to a metal halide precursor, purging the metal halide precursor from the processing chamber and then exposing the substrate to an alkyl aluminum precursor and an alane precursor, either sequentially or simultaneously. The alane precrursor comprises an amine-alane and a stabilizing amine selected from one or more of diemthylcyclohexylamine or dicyclomethylhexylamine.
Public/Granted literature
- US20140112824A1 Deposition Of Films Comprising Aluminum Alloys With High Aluminum Content Public/Granted day:2014-04-24
Information query
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