A semiconductor device includes a semiconductor chip including a main surface, an internal circuit including a plurality of transistors, formed on the main surface, a bonding pad electrically connected to the internal circuit, formed on the main surface, an inductor for communicating an external device in a non-contact manner, formed on the main surface, and a seal ring formed along an outer peripheral edge of the semiconductor chip to surround the internal circuit and the bonding pad in a plan view. The inductor has a configuration to surround the internal circuit and the bonding pad in the plan view and along the seal ring. The inductor is arranged inside the seal ring.