Invention Grant
- Patent Title: Thin chassis near field communication (NFC) antenna integration
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Application No.: US14797608Application Date: 2015-07-13
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Publication No.: US09685995B2Publication Date: 2017-06-20
- Inventor: Songnan Yang , Hao-Han Hsu , Ulun Karacaoglu , Anand Konanur , Eric Hong
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Forefront IP Lawgroup of Christie and Rivera, PLLC
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H04B5/00 ; H01Q1/22 ; H01Q1/44 ; H01Q7/00 ; H04M1/02 ; H04W4/00 ; H01Q1/48

Abstract:
Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
Public/Granted literature
- US20160014244A1 THIN CHASSIS NEAR FIELD COMMUNICATION (NFC) ANTENNA INTEGRATION Public/Granted day:2016-01-14
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