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公开(公告)号:US09685995B2
公开(公告)日:2017-06-20
申请号:US14797608
申请日:2015-07-13
Applicant: Intel Corporation
Inventor: Songnan Yang , Hao-Han Hsu , Ulun Karacaoglu , Anand Konanur , Eric Hong
CPC classification number: H04B5/0081 , H01Q1/22 , H01Q1/2216 , H01Q1/2266 , H01Q1/243 , H01Q1/44 , H01Q1/48 , H01Q7/00 , H04M1/026 , H04M1/0266 , H04W4/80
Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
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公开(公告)号:US20160014244A1
公开(公告)日:2016-01-14
申请号:US14797608
申请日:2015-07-13
Applicant: Intel Corporation
Inventor: SONGNAN YANG , Hao-Han Hsu , Ulun Karacaoglu , Anand Konanur , Eric Hong
CPC classification number: H04B5/0081 , H01Q1/22 , H01Q1/2216 , H01Q1/2266 , H01Q1/243 , H01Q1/44 , H01Q1/48 , H01Q7/00 , H04M1/026 , H04M1/0266 , H04W4/80
Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
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