Invention Grant
- Patent Title: Semiconductor packages
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Application No.: US15135364Application Date: 2016-04-21
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Publication No.: US09698088B2Publication Date: 2017-07-04
- Inventor: Heungkyu Kwon , Kang Joon Lee , JaeWook Yoo , Su-Chang Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2011-0048964 20110524
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/488 ; H01L23/16 ; H01L23/18 ; H01L25/065 ; H01L25/10 ; H01L23/00 ; H01L23/31 ; H01L23/13
Abstract:
Semiconductor packages include a first substrate including a central portion and a peripheral portion, at least one first central connection member attached to the central portion of the first substrate, and at least one first peripheral connection member attached to the peripheral portion of the first substrate. The first central connection member includes a first supporter and a first fusion conductive layer surrounding the first supporter.
Public/Granted literature
- US20160240509A1 SEMICONDUCTOR PACKAGES Public/Granted day:2016-08-18
Information query
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