Invention Grant
- Patent Title: Flexible substrate embedded with wires and method for fabricating the same
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Application No.: US14627913Application Date: 2015-02-20
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Publication No.: US09707706B2Publication Date: 2017-07-18
- Inventor: Chun-Wei Su , Chyi-Ming Leu , Yu-Ju Kuo , Hong-Ching Lin , Chun-An Lu , Chiung-Hsiung Chen
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW103145994A 20141229
- Main IPC: B29C39/02
- IPC: B29C39/02 ; H05K3/20 ; B29C39/00 ; B29C35/02 ; B29L31/34 ; B29K27/00 ; B29K79/00 ; B29K505/00

Abstract:
A flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires providing a carrier; forming a continuous wire pattern on the carrier, the continuous wire pattern containing a plurality of pores; covering a polymer material over the continuous wire pattern and the carrier and to fill into the pores; and separating the polymer material and the carrier to form a flexible substrate embedded with the continuous wire pattern” where the only change is the addition of wires.
Public/Granted literature
- US20150245470A1 FLEXIBLE SUBSTRATE EMBEDDED WITH WIRES AND METHOD FOR FABRICATING THE SAME Public/Granted day:2015-08-27
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