- 专利标题: Gate aligned contact and method to fabricate same
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申请号: US13995678申请日: 2011-12-22
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公开(公告)号: US09716037B2公开(公告)日: 2017-07-25
- 发明人: Oleg Golonzka , Swaminathan Sivakumar , Charles H. Wallace , Tahir Ghani
- 申请人: Oleg Golonzka , Swaminathan Sivakumar , Charles H. Wallace , Tahir Ghani
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 国际申请: PCT/US2011/066989 WO 20111222
- 国际公布: WO2013/095548 WO 20130627
- 主分类号: H01L21/768
- IPC分类号: H01L21/768 ; H01L27/088 ; H01L21/306 ; H01L27/02 ; H01L21/8234 ; H01L21/28 ; H01L29/66
摘要:
Gate aligned contacts and methods of forming gate aligned contacts are described. For example, a method of fabricating a semiconductor structure includes forming a plurality of gate structures above an active region formed above a substrate. The gate structures each include a gate dielectric layer, a gate electrode, and sidewall spacers. A plurality of contact plugs is formed, each contact plug formed directly between the sidewall spacers of two adjacent gate structures of the plurality of gate structures. A plurality of contacts is formed, each contact formed directly between the sidewall spacers of two adjacent gate structures of the plurality of gate structures. The plurality of contacts and the plurality of gate structures are formed subsequent to forming the plurality of contact plugs.
公开/授权文献
- US20130320456A1 GATE ALIGNED CONTACT AND METHOD TO FABRICATE SAME 公开/授权日:2013-12-05
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