Invention Grant
- Patent Title: Aqueous cleaning techniques and compositions for use in semiconductor device manufacture
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Application No.: US14578746Application Date: 2014-12-22
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Publication No.: US09728533B2Publication Date: 2017-08-08
- Inventor: Chun-Li Chou , Shao-Yen Ku , Pei-Hung Chen , Jui-Ping Chuang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/088 ; C11D7/32 ; C11D7/34 ; C11D11/00 ; H01L21/8238 ; H01L21/02 ; H01L27/092 ; H01L29/06 ; H01L29/66 ; H01L29/165
Abstract:
Some embodiments relate to a manufacturing method for a semiconductor device. In this method, a semiconductor workpiece, which includes a metal gate electrode thereon, is provided. An opening is formed in the semiconductor workpiece to expose a surface of the metal gate. Formation of the opening leaves a polymeric residue on the workpiece. To remove the polymeric residue from the workpiece, a cleaning solution that includes an organic alkali component is used. Other embodiments related to a semiconductor device resulting from the method.
Public/Granted literature
- US20150108578A1 AQUEOUS CLEANING TECHNIQUES AND COMPOSITIONS FOR USE IN SEMICONDUCTOR DEVICE MANUFACTURE Public/Granted day:2015-04-23
Information query
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