Invention Grant
- Patent Title: High voltage chuck for a probe station
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Application No.: US15072170Application Date: 2016-03-16
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Publication No.: US09741599B2Publication Date: 2017-08-22
- Inventor: Michael E. Simmons , Kazuki Negishi , Ryan Garrison , Philip Wolf
- Applicant: Cascade Microtech, Inc.
- Applicant Address: US OR Beaverton
- Assignee: Cascade Microtech, Inc.
- Current Assignee: Cascade Microtech, Inc.
- Current Assignee Address: US OR Beaverton
- Agency: Dascenzo Intellectual Property Law, P.C.
- Main IPC: H01L21/683
- IPC: H01L21/683 ; G01R31/26 ; G01R31/28
Abstract:
A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.
Public/Granted literature
- US20160195579A1 HIGH VOLTAGE CHUCK FOR A PROBE STATION Public/Granted day:2016-07-07
Information query
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