Invention Grant
- Patent Title: Manufacturing method of semiconductor structure for improving quality of epitaxial layers
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Application No.: US14964546Application Date: 2015-12-09
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Publication No.: US09741818B2Publication Date: 2017-08-22
- Inventor: Chueh-Yang Liu , Yu-Ying Lin , I-cheng Hu , Tien-I Wu , Yu-Shu Lin , Yu-Ren Wang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agency: Winston Hsu
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66 ; H01L29/78 ; H01L21/02 ; H01L21/311 ; H01L21/324

Abstract:
A manufacturing method of a semiconductor structure for improving quality of an epitaxial layer is provided in the present invention. The manufacturing method includes the following steps. A gate structure is formed on a semiconductor substrate, and two lightly doped regions are formed in the semiconductor substrate at two sides of the gate structure. A capping layer is formed on the gate structure and the lightly doped regions. Two epitaxial layers are formed at the two sides of the gate structure after the step of forming the capping layer. An oxide film formed on the lightly doped regions will influence the growth condition of the epitaxial layers. A removing process is performed to remove the oxide film on the lightly doped regions before the step of forming the capping layer so as to improve the quality of the epitaxial layers.
Public/Granted literature
- US20170170296A1 MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE FOR IMPROVING QUALITY OF EPITAXIAL LAYERS Public/Granted day:2017-06-15
Information query
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