Invention Grant
- Patent Title: Method for optimizing an integrated circuit layout design
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Application No.: US14807869Application Date: 2015-07-23
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Publication No.: US09747404B2Publication Date: 2017-08-29
- Inventor: Shih-Ming Kuo , Ming-Jui Chen , Te-Hsien Hsieh , Ping-I Hsieh , Jing-Yi Lee , Yan-Chun Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G03F1/36

Abstract:
A method for optimizing an integrated circuit layout design includes the following steps. A first integrated circuit layout design including a metal line feature having several metal lines and a second integrated circuit layout design including a hole feature having several holes are obtained. A line-end hole feature of the hole feature is selected by piecing the metal line feature with the hole feature. The line-end hole feature is classified into a single hole feature and a redundant hole feature by spacings between the adjacent holes by a computer system.
Public/Granted literature
- US20170024506A1 METHOD FOR OPTIMIZING AN INTEGRATED CIRCUIT LAYOUT DESIGN Public/Granted day:2017-01-26
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