Invention Grant
- Patent Title: Method for treating a semiconductor wafer
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Application No.: US14313366Application Date: 2014-06-24
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Publication No.: US09754787B2Publication Date: 2017-09-05
- Inventor: Johannes Laven , Hans-Joachim Schulze , Stephan Voss , Alexander Breymesser , Alexander Susiti , Shuhai Liu , Helmut Oefner
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L21/425
- IPC: H01L21/425 ; H01L21/263 ; H01L21/265 ; H01L21/324 ; H01L29/36 ; H01L29/66 ; H01L29/861 ; H01L29/872 ; H01L29/739 ; H01L29/16 ; H01L29/22

Abstract:
A Magnetic Czochralski semiconductor wafer having opposing first and second sides arranged distant from one another in a first vertical direction is treated by implanting first particles into the semiconductor wafer via the second side to form crystal defects in the semiconductor wafer. The crystal defects have a maximum defect concentration at a first depth. The semiconductor wafer is heated in a first thermal process to form radiation induced donors. Implantation energy and dose are chosen such that the semiconductor wafer has, after the first thermal process, an n-doped semiconductor region arranged between the second side and first depth, and the n-doped semiconductor region has, in the first vertical direction, a local maximum of a net doping concentration between the first depth and second side and a local minimum of the net doping concentration between the first depth and first maximum.
Public/Granted literature
- US20150371858A1 Method for Treating a Semiconductor Wafer Public/Granted day:2015-12-24
Information query
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