Invention Grant
- Patent Title: Integrated circuits with peltier cooling provided by back-end wiring
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Application No.: US15242643Application Date: 2016-08-22
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Publication No.: US09773717B1Publication Date: 2017-09-26
- Inventor: Siyuranga O. Koswatta , Sungjae Lee , Lan Luo , Scott K. Springer , Richard A. Wachnik
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Gibb & Riley, LLC
- Agent Anthony J. Canale
- Main IPC: H01L23/38
- IPC: H01L23/38 ; H01L35/20 ; H01L35/22 ; H01L35/04 ; H01L35/28 ; H01L35/34 ; H01L35/16 ; H01L35/18 ; H01L27/12 ; H01L27/16

Abstract:
A semiconductor structure comprises one or more semiconductor devices, each of the semiconductor devices having two or more electrical connections; one or more first conductors connected to a first electrical connection on the semiconductor device, the first conductor comprising a first material having a positive Seebeck coefficient; and one or more second conductors connected to a second electrical connection on the semiconductor device, the second conductor comprising a second material having a negative Seebeck coefficient. The first conductor and the second conductor conduct electrical current through the semiconductor device and conduct heat away from the semiconductor device.
Information query
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