- Patent Title: Conductive paste composition and method for manufacturing electrode
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Application No.: US14553181Application Date: 2014-11-25
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Publication No.: US09780236B2Publication Date: 2017-10-03
- Inventor: Chun-Yi Chiu , Kuo-Chan Chiou , Wei-Han Hsiao
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW102146538A 20131217
- Main IPC: H01B1/02
- IPC: H01B1/02 ; H01L31/0224 ; C09D5/24 ; C09J9/02 ; H01B1/22 ; H01B1/24 ; B22F1/00 ; C22C32/00 ; C09J11/04 ; C08K3/04 ; C08K3/08
Abstract:
Disclosed is a conductive paste composition, including 100 parts by weight of copper powder, 40 to 150 parts by weight of silver powder, 0.1 to 3 parts by weight of carbon powder, 1 to 5 parts by weight of glass powder, and 5 to 15 parts by weight of binder. The conductive paste composition can be applied on a substrate, and then sintered under atmosphere at a high temperature to form an electrode on the substrate.
Public/Granted literature
- US20150171238A1 CONDUCTIVE PASTE COMPOSITION AND METHOD FOR MANUFACTURING ELECTRODE Public/Granted day:2015-06-18
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