公开(公告)号：US10141083B2

公开(公告)日：2018-11-27

申请号：US14582555

申请日：2014-12-24

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Wei-Han Hsiao ,  Chun-Yi Chiu ,  Kuo-Chan Chiou ,  Tzong-Ming Lee

IPC: H01B1/02 ,  H01B1/22

Abstract: A transparent conductive film composite is provided. The transparent conductive film composite includes (a) 0.07-0.2 wt % of a metallic material; (b) 0.01-0.5 wt % of a dispersant; and 99.3-99.92 wt % of a solvent, wherein the metallic material (a) includes: (a1) 84-99.99 wt % of metal nanowires; and (a2) 0.01-16 wt % of micron metal flakes. A transparent conductive film manufactured from the transparent conductive film composite is also provided.

公开(公告)号：US09780236B2

公开(公告)日：2017-10-03

申请号：US14553181

申请日：2014-11-25

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chun-Yi Chiu ,  Kuo-Chan Chiou ,  Wei-Han Hsiao

IPC: H01B1/02 ,  H01L31/0224 ,  C09D5/24 ,  C09J9/02 ,  H01B1/22 ,  H01B1/24 ,  B22F1/00 ,  C22C32/00 ,  C09J11/04 ,  C08K3/04 ,  C08K3/08

CPC classification number: H01L31/022425 ,  B22F1/0014 ,  B22F2999/00 ,  C08K3/04 ,  C08K2003/0806 ,  C08K2003/085 ,  C08K2201/001 ,  C09D5/24 ,  C09J9/02 ,  C09J11/04 ,  C22C32/0089 ,  H01B1/22 ,  H01B1/24 ,  B22F3/10 ,  B22F2201/50

Abstract: Disclosed is a conductive paste composition, including 100 parts by weight of copper powder, 40 to 150 parts by weight of silver powder, 0.1 to 3 parts by weight of carbon powder, 1 to 5 parts by weight of glass powder, and 5 to 15 parts by weight of binder. The conductive paste composition can be applied on a substrate, and then sintered under atmosphere at a high temperature to form an electrode on the substrate.