Invention Grant
- Patent Title: Cell module assembly
-
Application No.: US14523387Application Date: 2014-10-24
-
Publication No.: US09786880B2Publication Date: 2017-10-10
- Inventor: Jaecheol Hwang , Yongseon Jo , Seokmin Kim
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2013-0127369 20131024
- Main IPC: H01M10/654
- IPC: H01M10/654 ; H01M10/613 ; H01M10/625 ; H01M10/6567 ; H01M2/10 ; H01M10/6551 ; H01M10/6555 ; H01M10/647 ; H01M10/6562

Abstract:
A cell module assembly is provided. The cell module assembly may include a plurality of cells that generates electrical energy, at least one heat plate interposed between the plurality of cells, to absorb heat from the plurality of cells, the at least one heat plate having a cooling channel defined at both ends thereof, and at least one cartridge to accommodate the plurality of cells and the at least one heat plate, the cooling channel being internally defined in the cartridge.
Public/Granted literature
- US20150147622A1 CELL MODULE ASSEMBLY Public/Granted day:2015-05-28
Information query