Invention Grant
- Patent Title: Hot melt adhesive
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Application No.: US14950253Application Date: 2015-11-24
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Publication No.: US09790409B2Publication Date: 2017-10-17
- Inventor: Makoto Takenaka , Ai Takamori , Tadashi Hayakawa
- Applicant: HENKEL AG & CO. KGAA
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Priority: JP2013-114704 20130530
- Main IPC: C09J167/04
- IPC: C09J167/04 ; C09J167/00 ; C09J165/00 ; C09J123/08 ; C09J125/08 ; C09J201/02 ; C08L67/04 ; C09J7/04 ; C09J167/02 ; C09J123/14 ; C08L53/02

Abstract:
An object of the present invention is to provide a hot melt adhesive being environmentally-friendly, having excellent adhesion property to various substrates such as paper substrate and polyolefin substrate, as well having excellent thermal stability. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) an aliphatic polyester-based resin, (C) an olefin-based polymer, and (D) a tackifier resin.
Public/Granted literature
- US20160075924A1 HOT MELT ADHESIVE Public/Granted day:2016-03-17
Information query
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