Invention Grant
- Patent Title: Stiffener tape for electronic assembly
-
Application No.: US14568552Application Date: 2014-12-12
-
Publication No.: US09793151B2Publication Date: 2017-10-17
- Inventor: Xavier Brun , Arjun Krishnan , Mohit Mamodia , Dingying Xu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/78 ; H01L21/304 ; H01L23/00
Abstract:
Some example forms relate to a stiffener tape for a wafer. The stiffener tape includes a mounting tape and a stiffener removably attached to the mounting tape. The stiffener tape further includes a die attach film attached to the stiffener. Other example forms relate to an electronic assembly that includes a wafer and a stiffener tape attached to the wafer. The stiffener tape includes a die attach film mounted to the wafer. A stiffener is attached to the die attach film and a mounting tape is removably attached to the stiffener. Still other example forms relate to a method that includes forming a stiffener tape which includes a mounting tape, a stiffener removably attached to the mounting tape and a die attach film attached to the stiffener.
Public/Granted literature
- US20160172229A1 STIFFENER TAPE FOR ELECTRONIC ASSEMBLY Public/Granted day:2016-06-16
Information query
IPC分类:
