Invention Grant
- Patent Title: Package board, method for manufacturing the same and package on package having the same
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Application No.: US14692101Application Date: 2015-04-21
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Publication No.: US09793250B2Publication Date: 2017-10-17
- Inventor: Myung Sam Kang , Young Gwan Ko , Hye Jin Kim , Hye Won Jung , Min Jae Seong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2014-0123862 20140917
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H01L25/10 ; H05K3/46 ; H01L23/13 ; H01L23/498 ; H01L23/14
Abstract:
There are provided a package board, a method for manufacturing the same, and a package on package having the same. The package board according to an exemplary embodiment of the present disclosure includes a first insulating layer formed with a cavity having a penetrating shape; and a first connection pad formed to penetrate through the first insulating layer and formed at one side of the cavity.
Public/Granted literature
- US20160081182A1 PACKAGE BOARD, METHOD FOR MANUFACTURING THE SAME AND PACKAGE ON PACKAGE HAVING THE SAME Public/Granted day:2016-03-17
Information query
