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公开(公告)号：US20140151095A1
公开(公告)日：2014-06-05
申请号：US14097036
申请日：2013-12-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Suk Hyeon Cho , Tae Hong Min , Seung Yeop Kook , Jung Han Lee , Hye Jin Kim
CPC classification number: H05K1/0306 , H05K1/03 , H05K3/108 , H05K3/426 , H05K2201/0141 , H05K2201/0145 , H05K2201/0154 , H05K2201/0158 , H05K2201/0195 , H05K2201/0323 , H05K2201/09563 , Y10T29/49155 , Y10T29/49165
Abstract: Disclosed herein is a printed circuit board, including: a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the composite sheet.
Abstract translation: 这里公开了一种印刷电路板，包括：复合片，其包括绝缘材料和与绝缘材料接合的玻璃板; 以及形成在复合片上的电路层。
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公开(公告)号：US20150114553A1
公开(公告)日：2015-04-30
申请号：US14460434
申请日：2014-08-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Suk Hyeon Cho , Sang Hoon Kim , Hye Jin Kim , Young Gwan Ko , Jung Han Lee
CPC classification number: B32B37/18 , B32B38/0004 , B32B38/0008 , B32B38/0036 , B32B38/10 , B32B2311/12 , B32B2315/08 , B32B2457/08 , H01L21/481 , H01L23/15 , H01L2924/0002 , H05K1/0306 , H05K3/022 , H05K3/4605 , H05K2203/1545 , H01L2924/00
Abstract: Disclosed herein is a method of manufacturing a glass core capable of continuously manufacturing the glass core by an automated process. The method includes: providing a glass sheet; laminating an insulating sheet on the glass sheet; laminating a copper clad sheet on the insulating sheet to manufacture the glass core; laminating a buffering sheet on the copper clad sheet; pressing and temporarily hardening the buffering sheet; delaminating the temporarily hardened buffering sheet; thermally hardening the glass core by a heater after the delaminating of the temporarily hardened buffering sheet; and cutting the glass core at a predetermined size after the thermal hardening of the glass core.
Abstract translation: 本文公开了一种制造能够通过自动化方法连续制造玻璃核心的玻璃核心的方法。 该方法包括：提供玻璃板; 在玻璃板上层叠绝缘片; 在绝缘片上层叠铜箔片以制造玻璃芯; 将缓冲片层压在铜包覆片上; 按压并暂时硬化缓冲片; 剥离临时硬化的缓冲片; 在暂时硬化的缓冲片分层之后，通过加热器对玻璃芯进行热硬化; 并且在玻璃芯的热硬化之后将玻璃芯切割成预定尺寸。
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公开(公告)号：US11955281B2
公开(公告)日：2024-04-09
申请号：US17321977
申请日：2021-05-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Hoon Kim , Chang Hee Lee , Jea Hoon Lee , Hye Jin Kim , Yeo Ju Cho
Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T≤t≤0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.
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公开(公告)号：US09793250B2
公开(公告)日：2017-10-17
申请号：US14692101
申请日：2015-04-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Myung Sam Kang , Young Gwan Ko , Hye Jin Kim , Hye Won Jung , Min Jae Seong
CPC classification number: H01L25/105 , H01L23/13 , H01L23/147 , H01L23/49811 , H01L23/49827 , H01L2224/16225 , H01L2224/48225 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H05K3/4682 , H05K3/4697
Abstract: There are provided a package board, a method for manufacturing the same, and a package on package having the same. The package board according to an exemplary embodiment of the present disclosure includes a first insulating layer formed with a cavity having a penetrating shape; and a first connection pad formed to penetrate through the first insulating layer and formed at one side of the cavity.
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