Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US14671278Application Date: 2015-03-27
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Publication No.: US09795999B2Publication Date: 2017-10-24
- Inventor: Takashi Ootagaki , Konosuke Hayashi , Yosuke Himori
- Applicant: SHIBAURA MECHATRONICS CORPORATION
- Applicant Address: JP Yokohama-shi
- Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee Address: JP Yokohama-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-065610 20140327
- Main IPC: B08B7/04
- IPC: B08B7/04 ; B08B3/08 ; H01L21/67

Abstract:
A substrate processing apparatus according to an embodiment includes: a liquid supplier configured to supply a processing liquid to a surface of a substrate; a temperature detector configured to detect a surface temperature of the substrate supplied with the processing liquid by the liquid supplier; a temperature monitor configured to determine whether or not the surface temperature detected by the temperature detector has reached a predetermined temperature; and a controller configured to cause the liquid supplier to stop supplying the processing liquid when the temperature monitor determines that the surface temperature has reached the predetermined temperature.
Public/Granted literature
- US20150273534A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2015-10-01
Information query
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