公开(公告)号：US09553003B2

公开(公告)日：2017-01-24

申请号：US14212382

申请日：2014-03-14

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Konosuke Hayashi ,  Masaaki Furuya ,  Takashi Ootagaki ,  Yuji Nagashima ,  Atsushi Kinase ,  Masahiro Abe

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/6704 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67115

Abstract: In a substrate processing device 10 having a heating and drying unit 103 for drying a surface of a substrate W, the heating and drying unit 103 heats upward a vertically downward surface of the substrate W to dry the surface of the substrate by dropping and removing, by gravity, the droplets of the volatile solvent formed on the surface of the substrate W by the heating operation.

Abstract translation: 在具有用于干燥基板W的表面的加热和干燥单元103的基板处理装置10中，加热和干燥单元103向上加热基板W的垂直向下的表面，以通过掉落和去除来干燥基板的表面， 通过重力，通过加热操作形成在基板W的表面上的挥发性溶剂的液滴。

公开(公告)号：US09694371B2

公开(公告)日：2017-07-04

申请号：US14670983

申请日：2015-03-27

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Takashi Ootagaki ,  Konosuke Hayashi

IPC: B05C5/02 ,  B05B1/26 ,  B05B3/10 ,  H01L21/67 ,  B05B3/04 ,  B05C13/02 ,  B05B13/02

CPC classification number: B05B1/265 ,  B05B3/0409 ,  B05B3/0486 ,  B05B3/1064 ,  B05B13/0235 ,  B05C5/02 ,  B05C13/02 ,  H01L21/67051 ,  H01L21/6715

Abstract: A substrate treatment apparatus according to the embodiment includes: a nozzle which ejects a treatment liquid onto a treatment target surface of a substrate; a trajectory deflector including a trajectory deflecting surface, which is an annular inclined surface that deflects a traveling direction of the treatment liquid ejected from the nozzle and makes the treatment liquid incident on the treatment target surface, the trajectory deflecting surface having an inclination angle varying in a direction of annular extension of the trajectory deflecting surface; and a position changer which moves an incident position of the treatment liquid on the trajectory deflecting surface in the direction of annular extension of the trajectory deflecting surface.

公开(公告)号：US10607863B2

公开(公告)日：2020-03-31

申请号：US15512308

申请日：2015-09-30

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Konosuke Hayashi ,  Takashi Ootagaki

IPC: H01L21/67 ,  B08B3/02 ,  B08B3/10 ,  B08B3/08

Abstract: According to one embodiment, a substrate processing apparatus includes: a removing part (D1) configured to remove liquid droplets present in a recess (30); a drain hole (30a) located at the bottom of the recess (30) of a nozzle head (32), and configured to discharge the liquid droplets as a target to be removed out of the recess (30); and a controller configured to control the discharge state of a gas discharge nozzle (33) such that there is a period in which a gas is discharged from the gas discharge nozzle (33) at a flow rate, at which the gas discharged does not reach a surface to be processed of s substrate W, in a period from the end of the rinsing process using a treatment liquid to the start of the drying process using the gas.

公开(公告)号：US10281210B2

公开(公告)日：2019-05-07

申请号：US14773055

申请日：2014-02-28

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Kunihiro Miyazaki ,  Konosuke Hayashi ,  Takashi Ootagaki ,  Yuji Nagashima

IPC: F26B3/30 ,  F26B7/00 ,  F26B11/18 ,  F26B3/28 ,  H01L21/02 ,  H01L21/67 ,  F26B5/00

Abstract: According to one embodiment, a substrate processing apparatus (1) includes a table (4) configured to support a substrate W, a solvent supply unit (8) configured to supply a volatile solvent to a surface of the substrate W on the table (4), and an irradiator (10) configured to emit light to the substrate W, which has been supplied with the volatile solvent, and function as a heater that heats the substrate W such that a gas layer is formed on the surface of the substrate W to make the volatile solvent into a liquid ball. Thus, it is possible to dry the substrate successfully as well as to suppress pattern collapse.

公开(公告)号：US09795999B2

公开(公告)日：2017-10-24

申请号：US14671278

申请日：2015-03-27

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Takashi Ootagaki ,  Konosuke Hayashi ,  Yosuke Himori

IPC: B08B7/04 ,  B08B3/08 ,  H01L21/67

CPC classification number: B08B3/08 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67248

Abstract: A substrate processing apparatus according to an embodiment includes: a liquid supplier configured to supply a processing liquid to a surface of a substrate; a temperature detector configured to detect a surface temperature of the substrate supplied with the processing liquid by the liquid supplier; a temperature monitor configured to determine whether or not the surface temperature detected by the temperature detector has reached a predetermined temperature; and a controller configured to cause the liquid supplier to stop supplying the processing liquid when the temperature monitor determines that the surface temperature has reached the predetermined temperature.

公开(公告)号：US10325787B2

公开(公告)日：2019-06-18

申请号：US14781077

申请日：2014-03-25

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Konosuke Hayashi ,  Takashi Ootagaki ,  Yuji Nagashima ,  Akinori Iso

IPC: B05D1/00 ,  B08B3/10 ,  H01L21/02 ,  H01L21/66 ,  H01L21/67 ,  H01L21/306 ,  H01L21/687

Abstract: According to one embodiment, a substrate processing apparatus (1) includes: a support (4) configured to support a substrate (W) in a plane; a rotation mechanism (5) configured to rotate the support (4) about an axis that crosses a surface of the substrate (W) supported by the support (4) as a rotation axis; a plurality of nozzles (6a, 6b, 6c), which are aligned from the center toward the periphery of the substrate (W) supported by the support (4), configured to eject a treatment liquid to the surface of the substrate (W) on the support (4) being rotated by the rotation mechanism (5), and a controller (9) configured to control the nozzles to eject the treatment liquid at different ejection timings according to the thickness of a film of the treatment liquid formed on the surface of the substrate (W) on the support (4) being rotated by the rotation mechanism (5).

公开(公告)号：US10276406B2

公开(公告)日：2019-04-30

申请号：US14212899

申请日：2014-03-14

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Konosuke Hayashi ,  Masaaki Furuya ,  Takashi Ootagaki ,  Yuji Nagashima ,  Atsushi Kinase ,  Masahiro Abe

IPC: B08B3/10 ,  H01L21/67

Abstract: A substrate processing device includes a suction drying section drying a surface of a substrate by absorbing and removing a liquid droplet of volatile solvent formed on the surface of the substrate by a heating operation of a heating section.

公开(公告)号：US09972513B2

公开(公告)日：2018-05-15

申请号：US15450542

申请日：2017-03-06

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Yuki Saito ,  Konosuke Hayashi ,  Takashi Ootagaki ,  Yuji Nagashima

IPC: H01L21/00 ,  H01L21/67

CPC classification number: H01L21/6708 ,  H01L21/67017 ,  H01L21/67253

Abstract: According to the embodiment, a substrate treating device 10 for treating a semiconductor wafer W using an etchant L containing hydrofluoric acid and nitric acid includes a storage tank 210 that stores the etchant L; a concentration sensor 256 that measures a concentration of nitrous acid in the etchant L; an alcohol feeding line 280 that feeds IPA to the etchant L and maintains the concentration of nitrous acid to a predetermined value or more; and a substrate treating unit 100 that feeds the etchant L in the storage tank 210 to the semiconductor wafer W. The substrate treating device can improve the etching efficiency by efficiently generating nitrous acid, and thereby producing an etchant having a nitrous acid concentration suitable for etching.

公开(公告)号：US09811096B2

公开(公告)日：2017-11-07

申请号：US14939008

申请日：2015-11-12

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Konosuke Hayashi ,  Takashi Ootagaki ,  Emi Matsui

IPC: G05D11/13 ,  B05B12/00 ,  G05D9/12 ,  B05C5/02 ,  H01L21/67 ,  B05B13/02

CPC classification number: G05D11/13 ,  B05B12/006 ,  B05B13/0242 ,  B05C5/02 ,  G05D9/12 ,  H01L21/67017 ,  H01L21/6708

Abstract: A liquid feeding device that feeds a treatment liquid to a treating device and also recovers the treatment liquid for re-feeding, include feeding tanks having an exhaust passage and an overflow line, and can be switched to one of a feeding mode in which the treatment liquid is fed and a standby mode in which the feeding tank is on standby while accommodating the treatment liquid; a feeding mechanism that feeds the treatment liquid to the treating device from the feeding tank in the feeding mode among the plurality of feeding tanks; a recovery mechanism that recovers and returns the treatment liquid excessive in the treatment device to the feeding tank in the feeding mode; and an on-off mechanism provided in each of the plurality of feeding tanks to block the exhaust passage and the overflow line is provided.

公开(公告)号：US09607865B2

公开(公告)日：2017-03-28

申请号：US14212218

申请日：2014-03-14

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Konosuke Hayashi ,  Masaaki Furuya ,  Takashi Ootagaki ,  Yuji Nagashima ,  Atsushi Kinase ,  Masahiro Abe

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67051 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6776

Abstract: A substrate processing device 100 includes a cleaning liquid supply unit 114 supplying a cleaning liquid to a surface of a substrate W, a solvent supply unit 115 supplying a volatile solvent to the surface of the substrate W supplied with the cleaning liquid to replace the cleaning liquid on the surface of the substrate W with the volatile solvent, a heating unit 117 heating the substrate W supplied with the volatile solvent, and a drying unit 118 drying the surface of the substrate W by removing a droplet of the volatile solvent produced on the surface of the substrate W by a heating operation of the heating unit 117, and the heating unit 117 and the drying unit 118 are arranged in a course of transportation of the substrate W transported from the solvent supply unit 115.