Invention Grant
- Patent Title: Element-accommodating package and mounting structure
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Application No.: US15111238Application Date: 2015-01-23
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Publication No.: US09805995B2Publication Date: 2017-10-31
- Inventor: Yoshiki Kawazu
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: Vople and Koenig, P.C.
- Priority: JP2014-011295 20140124
- International Application: PCT/JP2015/051904 WO 20150123
- International Announcement: WO2015/111721 WO 20150730
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H01L23/04 ; H01L23/057 ; H01L23/14 ; H01L23/552 ; H01R24/38 ; H01R103/00

Abstract:
An element-accommodating package which can improve frequency characteristics of an element-accommodating package having a coaxial connector, and a mounting structure are provided. An element-accommodating package includes a metallic substrate, a frame, a first coaxial connector, a second coaxial connector, and a circuit board. A groove is provided between one side of the frame and a side surface of the circuit board and between a first signal line and a second signal line.
Public/Granted literature
- US20160343628A1 ELEMENT-ACCOMMODATING PACKAGE AND MOUNTING STRUCTURE Public/Granted day:2016-11-24
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