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    High-frequency board, high-frequency package, and high-frequency module
    1.
    发明授权
    High-frequency board, high-frequency package, and high-frequency module 有权

    公开(公告)号：US11102880B2

    公开(公告)日：2021-08-24

    申请号：US16088258

    申请日：2017-03-27

    Applicant: KYOCERA Corporation

    Inventor： Yoshiki Kawazu

    IPC: H05K1/02 ,  H05K1/16

    Abstract: A high-frequency board includes an insulating substrate, a first line conductor, a second line conductor, a capacitor, a first bond, and a second bond. The insulating substrate has a recess on its upper surface. The first line conductor extends from an edge of the recess on the upper surface of the insulating substrate. The second line conductor faces the first line conductor across the recess on the upper surface of the insulating substrate. The capacitor overlaps the recess. The first bond joins the capacitor to the first line conductor. The second bond joins the capacitor to the second line conductor, and is spaced from the first bond.

    High-frequency board, high-frequency package, and high-frequency module
    2.
    发明授权
    High-frequency board, high-frequency package, and high-frequency module 有权

    公开(公告)号：US11758648B2

    公开(公告)日：2023-09-12

    申请号：US17394152

    申请日：2021-08-04

    Applicant: KYOCERA Corporation

    Inventor： Yoshiki Kawazu

    IPC: H05K1/02 ,  H05K1/16

    CPC classification number: H05K1/0251 ,  H05K1/162

    Abstract: A high-frequency board includes an insulating substrate, a first line conductor, a second line conductor, a capacitor, a first bond, and a second bond. The insulating substrate has a recess on its upper surface. The first line conductor extends from an edge of the recess on the upper surface of the insulating substrate. The second line conductor faces the first line conductor across the recess on the upper surface of the insulating substrate. The capacitor overlaps the recess. The first bond joins the capacitor to the first line conductor. The second bond joins the capacitor to the second line conductor, and is spaced from the first bond.

    Element housing package and mounting structure body
    4.
    发明授权
    Element housing package and mounting structure body 有权
    元件外壳和安装结构体

    公开(公告)号：US09462709B2

    公开(公告)日：2016-10-04

    申请号：US14407557

    申请日：2013-09-26

    Applicant: KYOCERA Corporation

    Inventor： Yoshiki Kawazu

    IPC: H01L23/055 ,  H05K1/18 ,  H05K5/02 ,  H05K5/00 ,  H05K1/02 ,  H05K1/11

    CPC classification number: H05K5/0091 ,  H01L23/055 ,  H01L2924/0002 ,  H05K1/0225 ,  H05K1/115 ,  H05K1/116 ,  H05K1/181 ,  H05K5/0239 ,  H05K5/0247 ,  H05K2201/093 ,  H05K2201/09627 ,  H05K2201/09718 ,  H05K2201/2018 ,  H01L2924/00

    Abstract: An element housing package includes a substrate, a frame body, and an input-output terminal. The input-output terminal has a wiring conductor formed in a stacked body consisting of dielectric layers and ground layers which are alternately laminated, to extend through an inside of the stacked body, and a lead terminal connected to the wiring conductor. A non-formation region is provided in the ground layers around the wiring conductor, which passes through the inside of the input-output terminal in a vertical direction of the stacked body. The non-formation region has, in order from an upper side toward a lower side, a first non-formation section, a second non-formation section having an area smaller than that of the first non-formation section, and a third non-formation section having an area larger than that of the second non-formation section.

    Abstract translation: 元件外壳包装件包括基板，框体和输入 - 输出端子。 输入输出端子具有形成在层叠体中的布线导体，该堆叠体由交替层叠的电介质层和接地层构成，以延伸穿过层叠体的内部，以及引线端子与布线导体连接。 在布线导体周围的接地层中设置非形成区域，该布线导体在层叠体的垂直方向上穿过输入输出端子的内部。 非形成区域具有从上侧朝向下侧的顺序，具有第一非形成部，具有比第一非成形部的面积小的面积的第二非成形部， 形成部具有比第二非成形部的面积大的面积。

    Electronic component housing package and electronic apparatus
    5.
    发明授权
    Electronic component housing package and electronic apparatus 有权
    电子元器件封装和电子设备

    公开(公告)号：US09386687B2

    公开(公告)日：2016-07-05

    申请号：US14367566

    申请日：2012-12-20

    Applicant: KYOCERA Corporation

    Inventor： Mahiro Tsujino ,  Yoshiki Kawazu

    IPC: H05K1/16 ,  H05K1/02 ,  H01L23/057 ,  H01L23/498 ,  H05K1/18

    CPC classification number: H05K1/0213 ,  H01L23/057 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2924/3011 ,  H05K1/024 ,  H05K1/18 ,  H05K2201/09336 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: While it is necessary for an electronic component housing package to be provided with numerous wiring conductors, phase differences of signals caused by differences in signal transmission distance among the wiring conductors, is a problem. An electronic component housing package based on one embodiment includes a substrate having a dielectric region and an electronic component placement region, a frame body surrounding the dielectric region and the placement region, and wiring conductors disposed on the dielectric region of the substrate. The wiring conductors have a first wiring conductor and a second wiring conductor which is longer in signal transmission distance than the first wiring conductor, which are disposed so as to extend from a location immediately below the frame body to the dielectric region. The frame body made of a dielectric material has a projection protruding from its inner periphery, which covers at least part of the first wiring conductor.

    Abstract translation: 虽然电子部件外壳封装需要多个布线导体，但是由布线导体之间的信号传输距离的差异引起的信号的相位差是一个问题。 基于一个实施例的电子部件壳体封装包括具有电介质区域和电子部件放置区域的基板，围绕介电区域和放置区域的框体，以及布置在基板的电介质区域上的布线导体。 所述布线导体具有第一布线导体和第二布线导体，所述第一布线导体和第二布线导体的信号传输距离比所述第一布线导体长，所述第一布线导体和所述第二布线导体被布置为从所述框体正下方的位置延伸到所述电介质 由介电材料制成的框架体具有从其内周突出的突起，其覆盖第一布线导体的至少一部分。

    ELEMENT HOUSING PACKAGE AND MOUNTING STRUCTURE BODY
    6.
    发明申请
    ELEMENT HOUSING PACKAGE AND MOUNTING STRUCTURE BODY 有权
    元件外壳和安装结构体

    公开(公告)号：US20150173214A1

    公开(公告)日：2015-06-18

    申请号：US14407557

    申请日：2013-09-26

    Applicant: KYOCERA Corporation

    Inventor： Yoshiki Kawazu

    IPC: H05K5/00 ,  H05K1/18 ,  H05K5/02 ,  H01L23/055

    CPC classification number: H05K5/0091 ,  H01L23/055 ,  H01L2924/0002 ,  H05K1/0225 ,  H05K1/115 ,  H05K1/116 ,  H05K1/181 ,  H05K5/0239 ,  H05K5/0247 ,  H05K2201/093 ,  H05K2201/09627 ,  H05K2201/09718 ,  H05K2201/2018 ,  H01L2924/00

    Abstract: An element housing package includes a substrate, a frame body, and an input-output terminal. The input-output terminal has a wiring conductor formed in a stacked body consisting of dielectric layers and ground layers which are alternately laminated, to extend through an inside of the stacked body, and a lead terminal connected to the wiring conductor. A non-formation region is provided in the ground layers around the wiring conductor, which passes through the inside of the input-output terminal in a vertical direction of the stacked body. The non-formation region has, in order from an upper side toward a lower side, a first non-formation section, a second non-formation section having an area smaller than that of the first non-formation section, and a third non-formation section having an area larger than that of the second non-formation section.

    Abstract translation: 元件外壳包装件包括基板，框体和输入 - 输出端子。 输入输出端子具有形成在层叠体中的布线导体，该堆叠体由交替层叠的电介质层和接地层构成，以延伸穿过层叠体的内部，以及引线端子与布线导体连接。 在布线导体周围的接地层中设置非形成区域，该布线导体在层叠体的垂直方向上穿过输入输出端子的内部。 非形成区域具有从上侧朝向下侧的顺序，具有第一非形成部，具有比第一非成形部的面积小的面积的第二非成形部， 形成部具有比第二非成形部的面积大的面积。

    ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC APPARATUS
    9.
    发明申请
    ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC APPARATUS 有权
    电子元件外壳和电子设备

    公开(公告)号：US20140345929A1

    公开(公告)日：2014-11-27

    申请号：US14367566

    申请日：2012-12-20

    Applicant: KYOCERA Corporation

    Inventor： Mahiro Tsujino ,  Yoshiki Kawazu

    IPC: H05K1/02 ,  H05K1/18

    CPC classification number: H05K1/0213 ,  H01L23/057 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2924/3011 ,  H05K1/024 ,  H05K1/18 ,  H05K2201/09336 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: While it is necessary for an electronic component housing package to be provided with numerous wiring conductors, phase differences of signals caused by differences in signal transmission distance among the wiring conductors, is a problem. An electronic component housing package based on one embodiment includes a substrate having a dielectric region and an electronic component placement region, a frame body surrounding the dielectric region and the placement region, and wiring conductors disposed on the dielectric region of the substrate. The wiring conductors have a first wiring conductor and a second wiring conductor which is longer in signal transmission distance than the first wiring conductor, which are disposed so as to extend from a location immediately below the frame body to the dielectric region. The frame body made of a dielectric material has a projection protruding from its inner periphery, which covers at least part of the first wiring conductor.

    Abstract translation: 虽然电子部件外壳封装需要多个布线导体，但是由布线导体之间的信号传输距离的差异引起的信号的相位差是一个问题。 基于一个实施例的电子部件壳体封装包括具有电介质区域和电子部件放置区域的基板，围绕介电区域和放置区域的框体，以及布置在基板的电介质区域上的布线导体。 所述布线导体具有第一布线导体和第二布线导体，所述第一布线导体和第二布线导体的信号传输距离比所述第一布线导体长，所述第一布线导体和所述第二布线导体被布置为从所述框体正下方的位置延伸到所述电介质 由介电材料制成的框架体具有从其内周突出的突起，其覆盖第一布线导体的至少一部分。

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