Invention Grant
- Patent Title: HEMT-compatible lateral rectifier structure
-
Application No.: US13956902Application Date: 2013-08-01
-
Publication No.: US09806158B2Publication Date: 2017-10-31
- Inventor: King-Yuen Wong , Yu-Syuan Lin , Chih-Wen Hsiung
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L29/66 ; H01L29/778 ; H01L29/861

Abstract:
The present disclosure relates to a high electron mobility transistor compatible power lateral field-effect rectifier device. In some embodiments, the rectifier device has an electron supply layer located over a layer of semiconductor material at a position between an anode terminal and a cathode terminal. A layer of doped III-N semiconductor material is disposed over the electron supply layer. A layer of gate isolation material is located over the layer of doped III-N semiconductor material. A gate structure is disposed over layer of gate isolation material, such that the gate structure is separated from the electron supply layer by the layer of gate isolation material and the layer of doped III-N semiconductor material. The layer of doped III-N semiconductor material modulates the threshold voltage of the rectifier device, while the layer of gate isolation material provides a barrier that gives the rectifier device a low leakage.
Public/Granted literature
- US20150034958A1 HEMT-COMPATIBLE LATERAL RECTIFIER STRUCTURE Public/Granted day:2015-02-05
Information query
IPC分类: