Invention Grant
- Patent Title: Printed circuit board and method of manufacturing the same
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Application No.: US15241714Application Date: 2016-08-19
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Publication No.: US09820378B2Publication Date: 2017-11-14
- Inventor: Jung Ho Hwang , Han Su Lee , Dae Young Choi , Soon Gyu Kwon , Dong Hun Jeong , In Ho Jeong , Kil Dong Son , Sang Hwa Kim , Sang Young Lee , Jae Hoon Jeon , Jin Hak Lee , Yun Mi Bae
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2015-0116680 20150819
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/02 ; H05K3/10 ; H05K3/24

Abstract:
Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.
Public/Granted literature
- US20170055347A1 Printed Circuit Board And Method Of Manufacturing The Same Public/Granted day:2017-02-23
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