Invention Grant
- Patent Title: Adhesive film and method for manufacturing semiconductor device
-
Application No.: US14915587Application Date: 2014-08-21
-
Publication No.: US09822284B2Publication Date: 2017-11-21
- Inventor: Shinichi Usugi , Kouji Igarashi , Akimitsu Morimoto
- Applicant: MITSUI CHEMICALS TOHCELLO, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUI CHEMICALS TOHCELLO, INC.
- Current Assignee: MITSUI CHEMICALS TOHCELLO, INC.
- Current Assignee Address: JP Tokyo
- Agency: Buchanan, Ingersoll & Rooney PC
- Priority: JP2013-178515 20130829
- International Application: PCT/JP2014/071891 WO 20140821
- International Announcement: WO2015/029871 WO 20150305
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/67 ; H01L23/29 ; C09J7/02 ; C09J201/00 ; H01L23/00 ; B32B7/12 ; B32B27/06 ; B32B27/28 ; B32B27/34 ; B32B27/36 ; B32B3/08 ; H01L21/683 ; B32B25/12 ; B32B25/18 ; B32B27/18 ; B32B27/08

Abstract:
An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150° C. for 30 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≦2%, and (2) after heating at 200° C. for 10 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≧3%.
Public/Granted literature
- US20160208144A1 ADHESIVE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2016-07-21
Information query
IPC分类: