公开(公告)号：US09611410B2

公开(公告)日：2017-04-04

申请号：US14364175

申请日：2012-12-07

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Shinichi Usugi ,  Noboru Kawasaki ,  Jun Kamada ,  Takuzo Aida

IPC: C09J133/08 ,  C07D319/06 ,  C09J201/02 ,  H01L21/683 ,  C09J133/14 ,  B32B43/00 ,  C09J7/02 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  C09J201/08

CPC classification number: C09J133/08 ,  B32B43/006 ,  C07D319/06 ,  C08L2203/14 ,  C09J7/385 ,  C09J133/14 ,  C09J201/02 ,  C09J201/08 ,  C09J2203/326 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/83191 ,  Y10T156/1153 ,  Y10T428/1476 ,  C08F2220/1858 ,  C08F2220/1825 ,  C08F220/14 ,  C08F220/20 ,  C08F212/14 ,  C08F220/06

Abstract: An adhesive resin composition includes an expandable sticky polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by the following general formula (1) and an adhesive resin.

公开(公告)号：US09822284B2

公开(公告)日：2017-11-21

申请号：US14915587

申请日：2014-08-21

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Shinichi Usugi ,  Kouji Igarashi ,  Akimitsu Morimoto

IPC: H01L21/56 ,  H01L21/67 ,  H01L23/29 ,  C09J7/02 ,  C09J201/00 ,  H01L23/00 ,  B32B7/12 ,  B32B27/06 ,  B32B27/28 ,  B32B27/34 ,  B32B27/36 ,  B32B3/08 ,  H01L21/683 ,  B32B25/12 ,  B32B25/18 ,  B32B27/18 ,  B32B27/08

CPC classification number: C09J7/0285 ,  B32B3/085 ,  B32B7/12 ,  B32B25/12 ,  B32B25/18 ,  B32B27/06 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B27/34 ,  B32B27/36 ,  B32B2307/306 ,  B32B2307/736 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2457/00 ,  B32B2457/14 ,  C09J7/20 ,  C09J7/255 ,  C09J7/385 ,  C09J201/00 ,  C09J2201/134 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2477/006 ,  C09J2479/086 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/26 ,  H01L24/96 ,  H01L2221/68381 ,  H01L2224/12105 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

Abstract: An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150° C. for 30 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≦2%, and (2) after heating at 200° C. for 10 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≧3%.

公开(公告)号：US10340172B2

公开(公告)日：2019-07-02

申请号：US15741564

申请日：2016-07-01

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Jun Kamada ,  Noboru Kawasaki ,  Shinichi Usugi ,  Makoto Sukegawa ,  Jin Kinoshita ,  Kouji Igarashi ,  Akimitsu Morimoto

IPC: C09J7/30 ,  B32B27/00 ,  B32B27/30 ,  H01L21/67 ,  C09J133/06 ,  C09J133/10 ,  C09J133/12 ,  C09J201/02 ,  H01L21/283 ,  H01L21/304 ,  H01L21/683 ,  H01L21/687

Abstract: This semiconductor wafer surface protection film has a substrate layer A, an adhesive absorption layer B, and adhesive surface layer C, in the stated order. The adhesive absorption layer B comprises an adhesive composition containing a thermoset resin b1, said adhesive absorption layer B having a minimum value G′bmin of the storage elastic modulus G′b in the range of 25° C. to less than 250° C. of 0.001 MPa to less than 0.1 MPa, a storage elastic modulus G′b250 at 250° C. of 0.005 MPa or above, and a temperature at which G′bmin is exhibited of 50-150° C. The adhesive surface layer C has a minimum value G′cmin of the storage elastic modulus G′c in the range of 25° C. to less than 250° C. of 0.03 MPa.

公开(公告)号：US20140322474A1

公开(公告)日：2014-10-30

申请号：US14364175

申请日：2012-12-07

Applicant: MITSUI CHEMICALS TOHCELLO, INC.,

Inventor： Shinichi Usugi ,  Noboru Kawasaki ,  Jun Kamada ,  Takuzo Aida

IPC: C09J133/08 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  B32B43/00 ,  C09J7/02

CPC classification number: C09J133/08 ,  B32B43/006 ,  C07D319/06 ,  C08L2203/14 ,  C09J7/385 ,  C09J133/14 ,  C09J201/02 ,  C09J201/08 ,  C09J2203/326 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/83191 ,  Y10T156/1153 ,  Y10T428/1476 ,  C08F2220/1858 ,  C08F2220/1825 ,  C08F220/14 ,  C08F220/20 ,  C08F212/14 ,  C08F220/06

Abstract: An adhesive resin composition of the present invention includes an expandable sticky polymer having a structure derived from a Meldrum's acid derivative, or a Meldrum's acid derivative represented by the following general formula (1) and an adhesive resin.

Abstract translation: 本发明的粘合树脂组合物包括具有衍生自Meldrum酸衍生物的结构的可膨胀粘性聚合物或由以下通式（1）表示的Meldrum酸衍生物和粘合剂树脂。