Invention Grant
- Patent Title: Cleaning composition and method for cleaning semiconductor wafers after CMP
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Application No.: US14993837Application Date: 2016-01-12
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Publication No.: US09828574B2Publication Date: 2017-11-28
- Inventor: Roman Ivanov , Fernando Hung , Cheng-Yuan Ko , Fred Sun
- Applicant: Cabot Microelectronics Corporation
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas Omholt; Erika S. Wilson; Salim A. Hasan
- Main IPC: C11D7/32
- IPC: C11D7/32 ; C11D11/00 ; H01L21/02 ; C11D7/06
Abstract:
The invention provides a composition for cleaning contaminants from semiconductor wafers following chemical-mechanical polishing. The cleaning composition contains one or more quaternary ammonium hydroxides, one or more organic amines, one or more metal inhibitors, and water. The invention also provides methods for using the cleaning composition.
Public/Granted literature
- US20160201016A1 CLEANING COMPOSITION AND METHOD FOR CLEANING SEMICONDUCTOR WAFERS AFTER CMP Public/Granted day:2016-07-14
Information query
