Invention Grant
- Patent Title: Optoelectronic semiconductor component with sapphire flip-chip
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Application No.: US14413670Application Date: 2013-07-18
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Publication No.: US09847461B2Publication Date: 2017-12-19
- Inventor: Matthias Sabathil , Stefan Illek , Thomas Schwarz
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE102012213343 20120730
- International Application: PCT/EP2013/065159 WO 20130718
- International Announcement: WO2014/019861 WO 20140206
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/54 ; H01L33/62 ; H01L33/50 ; H01L33/52 ; H01L33/58 ; H01L33/60 ; H01L25/075
Abstract:
An optoelectronic semiconductor component has a volume-emitting sapphire flip-chip with an upper side and a lower side. This optoelectronic semiconductor component is embedded in an optically transparent mold body with an upper side and a lower side.
Public/Granted literature
- US20150137162A1 Optoelectronic Semiconductor Component with Sapphire Flip-Chip Public/Granted day:2015-05-21
Information query
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