Invention Grant
- Patent Title: Electromigration testing of interconnect analogues having bottom-connected sensory pins
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Application No.: US14635125Application Date: 2015-03-02
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Publication No.: US09851397B2Publication Date: 2017-12-26
- Inventor: Fen Chen , Cathryn J. Christiansen , Deborah M. Massey , Prakash Periasamy , Michael A. Shinosky
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent David Cain
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/28 ; H01L21/00 ; G01N1/00

Abstract:
A system for electromigration testing is disclosed. The system includes a conductive member, a cap layer of insulative material over at least a portion of a top surface of the conductive member, a cathode conductively connected to a first end of the conductive member; an anode conductively connected to a second end of the conductive member, and a current source conductively connected to the cathode and the anode. A plurality of sensory pins are disposed along a length of the conductive member between the first end and the second end of the conductive member. The sensory pins are conductively connected to a bottom surface of the conductive member. At least one measurement device is conductively connected to at least one sensory pin of the plurality of sensory pins. The at least one measurement device determines a resistance of at least one portion of the conductive member.
Public/Granted literature
- US20160258998A1 ELECTROMIGRATION TESTING OF INTERCONNECT ANALOGUES HAVING BOTTOM-CONNECTED SENSORY PINS Public/Granted day:2016-09-08
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