- 专利标题： Stacked grid for more uniform optical input
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申请号： US14688106申请日： 2015-04-16
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公开(公告)号： US09853076B2公开(公告)日： 2017-12-26
- 发明人: Yun-Wei Cheng , Horng-Huei Tseng , Chao-Hsiung Wang , Chun-Hao Chou , Tsung-Han Tsai , Kuo-Cheng Lee , Yung-Lung Hsu
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Eschweiler & Potashnik, LLC
- 主分类号： H01L31/0232
- IPC分类号： H01L31/0232 ; H04N5/335 ; H01L27/146 ; H01L31/062 ; H04N3/14 ; H01L31/18
摘要：
A back side illumination (BSI) image sensor with stacked grid shifting is provided. A pixel sensor is arranged within a semiconductor substrate. A metallic grid segment is arranged over the pixel sensor and has a metallic grid opening therein. A center of the metallic grid opening is laterally shifted from a center of the pixel sensor. A dielectric grid segment is arranged over the metallic grid and has a dielectric grid opening therein. A center of the dielectric grid opening is laterally shifted from the center of the pixel sensor. A method for manufacturing the BSI image sensor is also provided.
公开/授权文献
- US20160307941A1 STACKED GRID FOR MORE UNIFORM OPTICAL INPUT 公开/授权日：2016-10-20
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