- 专利标题： Via and trench filling using injection molded soldering
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申请号： US15214942申请日： 2016-07-20
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公开(公告)号： US09861313B1公开(公告)日： 2018-01-09
- 发明人: John U. Knickerbocker , Shriya Kumar , Jae-Woong Nah
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Ryan, Mason & Lewis, LLP
- 代理商 Louis J. Percello
- 主分类号： H01L41/113
- IPC分类号： H01L41/113 ; A61B5/00 ; B23K3/06 ; A61M5/00 ; B23K101/36
摘要：
A method includes forming one or more trenches in a first substrate, forming one or more vias in a second substrate, aligning at least a first trench in the first substrate with at least a first via in the second substrate, and sealing the first substrate to the second substrate by filling the first via and the first trench with solder material using injection molded soldering.
公开/授权文献
- US20180000412A1 VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING 公开/授权日：2018-01-04
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