Various embodiments implementing a multi-fabric mixed-signal electronic system design spanning across multiple design fabrics with electrical and/or thermal analysis awareness. A schematic design may be extracted from and a power delivery network (PDN) model may be determined from a plurality of layouts in multiple design fabrics in a multi-fabric design environment platform. A PDN-aware, multi-fabric full system schematic may be constructed by assembling the PDN model and the schematic design into the PDN-aware, multi-fabric full system schematic. For a schematic generated for a circuit block of interest, chip power models may be determined for the remaining portion of the multi-fabric mixed-signal electronic system design, and the PDN-aware, multi-fabric full system schematic may be updated by accounting for the chip power models. The circuit block of interest may then be electrically and/or thermally analyzed within the context of the remaining portion.